Micron Technology announced it is working with Qualcomm Technologies to enable an advanced automotive connectivity solution that leverages 5G networks for autonomous driving and direct cellular vehicle-to-everything (C-V2X) communication. The new Qualcomm Snapdragon Automotive 5G Platform will feature a custom Micron 149 ball count multichip package, allowing for speeds of up to 20 times faster than current LTE-Advanced modems. Faster modem speeds widen the possibilities for vehicles to connect to other vehicles, roadside infrastructure and beyond.

The Snapdragon Automotive 5G Platform with integrated C-V2X direct communication technology is designed to provide the low latency, high data speed, and reliable cellular connection coverage required for next-generation connected cars and autonomous driving.

Micron created a portfolio of ultra-small 8×9.5mm, 149 ball count multichip package (MCP) solutions with SLC NAND plus LPDDR4 rated at automotive temperature grade to pair with the Snapdragon Automotive 5G Platform, creating opportunities for immersive in-vehicle experiences and automotive safety.