CEVA, the leading licensor of wireless connectivity and smart sensing technologies, announced SensPro, the industry’s first high performance sensor hub DSP architecture designed to handle the broad range of sensor processing and sensor fusion workloads for contextually-aware devices.

SensPro addresses the need for specialized processors to efficiently handle the proliferation of different types of sensors that are required in smartphones, robotics, automotive, AR/VR headsets, voice assistants, smart home devices and for emerging industrial and medical applications that are being revolutionized with initiatives like Industry 4.0. These sensors, among which are camera, Radar, LiDAR, Time-of-Flight (ToF), microphones and inertial measurement units (IMU), generate a multitude of data types and bit-rates derived from imaging, sound, RF and motion, which can be used to create a full 3D contextually-aware device.

Built from the ground up to maximize performance-per-watt for complex multi-sensor processing use cases, the SensPro architecture offers a combination of high performance single and half precision floating-point math required for high dynamic range signal processing, point cloud creation and deep neural network (DNN) training, along with a large amount of 8- and 16-bit parallel processing capacity required for voice, imaging, DNN inference processing and Simultaneous Localization and Mapping (SLAM). SensPro incorporates CEVA’s widely used CEVA-BX scalar DSP, which offers a seamless migration path from single sensory system designs to multi-sensor, contextual-aware designs.

SensPro uses a highly-configurable 8-way VLIW architecture, allowing it to be easily tuned to address a wide range of applications. It employs a micro-architecture that combines scalar and vector processing units and incorporates an advanced, deep pipeline enabling operating speeds of 1.6GHz at a 7nm process node. SensPro incorporates a CEVA-BX2 scalar processor for control code execution with a 4.3 CoreMark/MHz score. It adopts a wide SIMD scalable processor architecture for parallel processing and is configurable for up to 1024 8×8 MACs, 256 16×16 MACs, dedicated 8×2 Binary Neural Networks support, as well as 64 single precision and 128 half precision floating point MACs. This allows it to deliver 3 TOPS for 8×8 networks inferencing, 20 TOPS for Binary Neural Networks inferencing, and 400 GFLOPS for floating point arithmetic. Other key features of SensPro include a memory architecture providing a bandwidth of 400GB per second, 4-way instruction cache, 2-way vector data cache, DMA, and queue and buffer managers for offloading the DSP from data transactions.

SensPro is accompanied by an advanced set of software and development tools to expedite system designs including an LLVM C/C++ compiler, Eclipse based integrated development environment (IDE), OpenVX API, software libraries for OpenCL, CEVA deep neural network (CDNN) graph compiler including the CDNN-Invite API for inclusion of custom AI engines, CEVA-CV imaging functionsCEVA-SLAM software development kit and vision librariesClearVox noise reductionWhisPro speech recognitionMotionEngine sensor fusion, and the SenslinQ software framework.

Initially, SensPro DSPs will be available in three configurations, each including a CEVA-BX2 scalar processor and various vector units configured for optimal use-case handling:

  • SP250 – single vector unit with 256 8×8 MACs targeting imaging, vision, and sound centric applications
  • SP500F – single vector unit with 512 8×8 MACs and 64 single precision floating point MACs targeting SLAM centric applications
  • SP1000 – dual vector units with 1024 8×8 MACs and binary networks support targeting AI centric applications